KD-2445 COB packaging silicon glue
本产品为双组分加成型、无溶剂、高纯度的热固化性有机硅封装材料，主要适用于LED的制造中。产品固化物可保护芯片和微连接线路不受外界损害，抵抗环境中污染、湿气、冲击、震动等带来的影响。本产品可在广泛的温度、湿度及其恶劣的环境下保持光学特性、物理机械性能和电学性能的稳定，可满足多种形式的封装。
INFOMATION
Product features:
High light transmittance, high purity
Excellent electrical and physical and mechanical properties
Suitable for reflow soldering process
Heat resistance superior performance
UV resistance is strong, low light failure
A good bonding effect, wide application scope
1, product introduction
This product is a two-component plus molding, without solvent, high purity of heat curing organic silicon encapsulating materials, mainly is suitable for the leds. Cured products can protect the chip and micro connections from external damage, resistance to environment pollution, the effects of moisture, shock, vibration, etc. This product is available in a wide range of temperature, humidity and the rough environment of optical properties, physical and mechanical properties and electrical performance stability, can meet various kinds of packaging.
2, typical physical properties
| Before curing | |||
| Component | A | B | |
| Appearance | Transparent flow of liquid | ||
| Viscosity range | Before Mix | 4000 cps | 2200 cps |
| After Mix | 3000±500 cps | ||
| Mix refractive index（ND25） | 1.41 | ||
| Impurity content | K+≤2ppm、Na+≤2ppm | ||
| After curing | |||
| Light transmittance,2mm | ≥95%（450nm） | ||
| Light decay (6000 hours) | ≤2% | ||
| hardness （Shao） | 35±5A | ||
| Volume resistivity （Ω.cm） | 1015Ω.cm | ||
| Linear thermal expansion coefficient（ppm/k） | <260 | ||
| Method of application | |||
| AB component proportion | A：B = 1:1 | ||
| Curing temperature | 2 hours/110℃ | ||
| Cure time | 2 hours | ||
| Operating time | 8 hours | ||
| Storage conditions | |||
| Storage temperature | Room temperature storage, conditional storage at low temperature | ||
| Storage time | Six month | ||
3, the instructions
3.1 before using this product, the substrate surface should be kept clean and dry. Can remove the moisture on the surface of the substrate heating; Can be used without solubility and corrosive suitable solvent, such as naphtha, acetone, etc.) clean surface of base material.
3.2 according to the mixed proportion of recommended A/B = 1:1 (weight ratio), accurate weighing to clean containers, and fully mixing, vacuum deaeration.
3.3 In order to ensure the operability of the rubber,A, B After Mix use up in 0.5 hours.
3.4 packaging good chip into the oven curing, such as the recommended curing condition, the customer can be adjusted according to actual conditions.
4, product packaging and shipping
This article points A and B component, specifications for bottled 500 g / 500 g/A and B. Such products are non-dangerous goods, according to the general chemical transportation.
5, product storage
Part A and part B must be sealed separately stored in A cool, ventilated, indoor below 25 ℃, shelf life Six month.
6, matters needing attention
1. Part A and part B must be kept sealed, after opening has not used up still must cover letter, avoid contact with moisture in the air.
2. The product is prohibited to contact nitrogen, phosphorus, sulfur, acetylene, vinyl, peroxide and lead, tin, cadmium and other metal compound, and avoid causing catalyst poisoning effect curing effect.
The reliable data for the laboratory measured above, only for the user test and used as a reference. Because of equipment, materials, operations, such as is not the same, we can't to guarantee individual circumstances, including patent rights, please cond
