KD-2362 LED filament glue & packaging glue
This product is designed for filament LED resistance to high temperature of two-component molding LED encapsulation adhesive. Product resistance of 180 ℃ high temperature for a long time, the instantaneous high temperature 300 ℃, and the circuit board, sapphire, quartz glass, transparent ceramics such as stent has good adhesion, good product after curing light transmittance; High lumen value; Resistance to high temperature aging performance.
INFOMATION
Product features:
High light transmittance, high refractive index, high purity, excellent thixotropy.
Excellent electrical and physical and mechanical properties
Suitable for reflow soldering process
Heat resistance superior performance
UV resistance is strong, low light failure
Product of sapphire and bonding performance of glass and ceramics, the firm bonding of filament stents, bond lasting;
1, product introduction
This product is designed for filament LED resistance to high temperature of two-component molding LED encapsulation adhesive. Product resistance of 180 ℃ high temperature for a long time, the instantaneous high temperature 300 ℃, and the circuit board, sapphire, quartz glass, transparent ceramics such as stent has good adhesion, good product after curing light transmittance; High lumen value; Resistance to high temperature aging performance.
2, typical physical properties
| Before curing | |||
| Component | A | B | |
| Appearance | Light white transparent | Light white transparent | |
| Viscosity range | Before Mix | 30000cps | 20000cps |
| After Mix | 23000cps | ||
| After mix refractive index（ND25） | 1.43 | ||
| Impurity content | K+≤2ppm、Na+≤2ppm | ||
| After curing | |||
| Light transmittance,2mm | 90%（450nm） | ||
| hardness （Shao） | 60±5A | ||
| Tensile Strength （MPa） | >3.5 | ||
| Volume resistivity （Ω.cm） | 1015Ω.cm | ||
| Linear thermal expansion coefficient（ppm/k） | <280 | ||
| Method of application | |||
| AB component proportion | A：B = 1:1 | ||
| Curing temperature | 1 hour/60℃+3 hours/150 ℃ | ||
| Cure time | 4 hours | ||
| Operating time | 8 hours | ||
| Storage conditions | |||
| Storage temperature | Room temperature storage, conditional storage at low temperature | ||
| Storage time | Six month | ||
3, the instructions
3.1, support dehumidification: stay wrapped filament scaffold to clean and high temperature (150 degrees of above 1 h) and dehumidifying;
3.2, with glue: depending on the number is expected to use the glue, accurate weighing A certain quality of A agent and the corresponding percentage of B agent.
3.3, deaeration: will match good silicone fully mixing, and the bubble complete removal.
After 3.4, dispensing: determine the silicone no bubble, dispensing.
3.5, cure: put encapsulated stents in blast oven curing, recommended curing conditions for 1 hour / 60 ℃ / 150 ℃ + 3 hours.
4, product packaging and shipping
Points A and B components, specifications for 500 g plastic bottles or 5-25 l plastic packaging (other packaging according to customer requirements). Such products are non-dangerous goods, according to the general chemical transportation.
5, product storage
Part A and part B must be sealed separately stored in A cool, ventilated, indoor below 25 ℃, shelf life Six month.
6, matters needing attention
6.1, the product before use, should guarantee the other kinds of packaging material is dry, avoid moisture infiltration.
6.2, encapsulation process, the journey on nitrogen, phosphorus, sulfur, vinyl, peroxide, lead, tin, cadmium and other metal compounds, avoid the silicon rubber curing of catalyst poisoning caused by incomplete.
The reliable data for the laboratory measured above, only for the user test and used as a reference. Because of equipment, materials, operations, such as is not the same, we can't to guarantee individual circumstances, including patent rights, please cond
